Ability's CAE Thermal Team offers accurate temperature and thermal risk prediction. We specialize in optimizing thermal dissipation efficiency and solutions during the design phase.
Our Services Include
- Identifying system weaknesses
- Ensuring uniform internal device temperatures
- Verifying PCB simulation results
- Evaluating external surface temperature distribution
- Assessing product operating environments and setting appropriate thermal convection conditions
Identifying System Weaknesses
Optimize the Temperature Uniformity
Verifying PCB Simulation Results
- A : The dense components located behind the ASIC contribute to a more uniform distribution of heat.
- B : Power electronics generate high currents on printed circuit boards (PCBs), which can result in elevated temperatures.
- C : Scarcity of components in this area, along with the absence of heat-emitting parts, creates a significant thermal difference.
Temperature Distribution on the Exterior Surface
Evaluate the Operating Environment
Product Test in the Application Environment
Mapping the Simulation to Obtain Numerical Parameters
Thermal Environment Reliability & Energy Technology
Our advanced tools and methods ensure precise thermal analysis and reliable results:
- Data Recorder: Captures accurate temperature data from specified measurement points for thorough analysis.
- Thermal Imager: Provides clear visualization of real-time temperature distribution for effective monitoring.
- Natural Convection Box: Simulates a no-wind environment to conduct realistic and controlled thermal testing.
- Anemometer: Measures wind speed in various settings, including cars, outdoor spaces, and offices, for versatile environmental assessments.
- Temperature Chamber: Creates a controlled environment with variable temperature and humidity to test products under different ambient conditions.
