highperformance-electronics

Experience in Diverse Electronics Expertise

Our team of skilled engineers possesses extensive expertise in imaging technology. We specialize in the seamless integration of sensors, optimization of power consumption, ensuring  electromagnetic compatibility (EMC) compliance, and  enhancing radio frequency (RF) performance. With years of experience, we have refined our ability to deliver exceptional imaging solutions tailored to your unique needs. Whether you require high-resolution cameras, High-speed motion image analysis system, or advanced machine vision applications, we have the expertise to turn your vision into reality. 

 

POWER

• Battery Charger : DC/DC AC/DC Converter
• PoE Power: 802.3 AF/AT
• Other: Backlight Driver, Flash Charger

RF

• LTE Module
• WIFI Module
• WIFI+BT Module
• GPS Module
• NFC IC

SENSOR

• Image Sensor: Sony, Panasonic, Sharp, OV, On-Semi, Smart sense
• Detection Sensor: E-Compass, Gyro, G-sensor, Humidity, Pressure, Temperature, Light sensor, PIR 

EMC

• FCC Part15B Class B
• EN55032 Class B
• EN50121-1
• EN50121-3-2
• EN50121-4

 

 

Pioneering the Future of RF

The rapid advancement of RF technology has significantly transformed the way we communicate. Since 2011, we have been at the forefront of technology, actively engaging in the research and development, and application of a series of technologies, including antenna design, Wi-Fi 4.0, NFC, BT4.0, GNSS, WiFi 5, LTE, BT5.3, and LTE Cat 1. Our extensive technical experience has enabled us to provide robust powerful wireless connectivity for numerous imaging products.

Advanced Image Sensing Technology

Our sensing technology goes beyond traditional imaging, delving deeply into integrating multiple types of sensors to achieve seamless data fusion and intelligent decision-making. For example:

• Combining image technology with IMU enables image stabilization.
• Integrating image technology with PIR or millimeter-wave sensors triggers video recording only within the detection range, optimizing energy efficiency.
• Merging image technology with ToF combines 2D images with depth data to create 3D visualizations.

IMU

- G-sensor
   3 axis MEMS
- Gyro
   3 – axis MEMS
- E-Compass
  1300μT(x-, y-axis)

Temperature

- Analog type
- 55°C to +130°C/±1.5°C/Linear 
- Digital type
- 40°C to +125°C/±0.5°C/Digital Output (I2C)
- NTC Thermistor
- 40°C to +125°C/±1°C

Pressure

- 260 ~ 1260 hPa  
- 0.01 hPa RMS/24-bit
- 1 Hz ~ 25 Hz(ODR)
- SPI/I2C/FIFO

Humidity

- Embedded PTFE filter 
- +/-5%RH max tolerance @55%RH
- IP67/I2C

Light Sensor

- Analog 
   0 ~ 400 Lux/320nm ~ 750nm/ ±30%/Voltage Output
- Digital
   0 ~ 1000 Lux/320nm ~ 750nm/±20%/Digital Output /I2C

mmWave

- FMCW/180MHz/VCO/synthesizer
- Variable chirp 220/1100/
  4400μs@180MHz/8m@FOV 120degree
- 2 RX antennas
- SPI/I2C

PIR

- Spectral  : 8 ~ 13 um
- FOV : 150(X.Y.) x 159(Z.)
- ADC : 14bit
- Sensitivity : 8bit
- Blind Time : 0.5 ~ 8 Sec

TOF

- Module
  VGA 30fps/FOV 90x70/Vcsel 850/Vcsel 940mm/Indoor & Outdoor
- Device
  2M RGB+ToF/ USB3.0/Ethernet/Point cloud/ HDR/PC tool(demo)

RGB

- 2~20M/120 fps
- SLVS-EC/SLVS /LVDS/MIPI CSI-2
- HDR/WDR/PDAF

Electromagnetic Interference and the Imaging Revolution: The Evolution of EMI in Digital Cameras to Vehicle Vision Systems

As imaging products have evolved from digital cameras to in-vehicle vision systems, the electromagnetic environment has become increasingly complex. Canon has always prioritized customer needs, consistently investing in research and development to improve the electromagnetic compatibility of our products. By establishing a comprehensive EMI testing environment and leveraging our extensive experience, we ensure that our products meet stringent international standards, providing our customers with high-quality and reliable imaging solutions.

Imaging Product Design Compliant with Global Certification Standards

Our imaging product designs comply with global certification standards for power, safety, and wireless transmission from the beginning. This ensures product quality and reliability, reducing time-to-market, and enhances  market competitiveness.